IC & SENSOR PACKAGING EXPO Tokyo 2026, part of NEPCON Japan, will be held from January 21–23, 2026, at Tokyo Big Sight, Japan. The event showcases advanced IC and sensor packaging technologies, materials, and equipment, attracting global semiconductor, MEMS, and electronics manufacturers for innovation, sourcing, and collaboration opportunities.
When & Where
Date and time
January 21, 2026 at 2:56 PM
Location
3-21-1 Ariake Kotu-ku, 135-0063 Tokyo, Tokyo, Japan
