INTERMOLD Osaka is a leading trade fair dedicated to die and mold manufacturing, precision machining, and metal processing technologies. Scheduled for April 15–17, 2026, at INTEX Osaka, the event brings together global manufacturers, engineers, and suppliers to showcase innovations in CAD/CAM, 3D printing, tooling, and advanced production systems, driving growth in Japan’s manufacturing industry.
When & Where
Date and time
April 15, 2026 at 2:23 PM
Location
1-5-102, Nanko-kita, Suminoe-ku, 531-6035 Osaka, Ōsaka, Japan
