Past event
IC & Sensor Packaging Expo Tokyo 2026 | NEPCON Japan
- Date
- Wednesday, 21 January 2026
- Location
- 3-21-1 Ariake Kotu-ku, 135-0063 Tokyo, Tokyo, Japan
IC & SENSOR PACKAGING EXPO Tokyo 2026, part of NEPCON Japan, will be held from January 21–23, 2026, at Tokyo Big Sight, Japan. The event showcases advanced IC and sensor packaging technologies, materials, and equipment, attracting global semiconductor, MEMS, and electronics manufacturers for innovation, sourcing, and collaboration opportunities.
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- 5 Nov 2026Denkmal 2026 | European Fair for Conservation & RestorationLeipzig, Germany
- 10 Nov 2026BrauBeviale 2026 | Beverage Industry Trade Fair GermanyExhibition Centre Nuremberg
- 10 Nov 2026EuroTier 2026 | Global Animal Farming ExhibitionHanover (Hannover), Germany
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