Past event
INTERMOLD Osaka 2026 | Die & Mold Manufacturing Expo
- Date
- Wednesday, 15 April 2026
- Location
- 1-5-102, Nanko-kita, Suminoe-ku, 531-6035 Osaka, Ōsaka, Japan
INTERMOLD Osaka is a leading trade fair dedicated to die and mold manufacturing, precision machining, and metal processing technologies. Scheduled for April 15–17, 2026, at INTEX Osaka, the event brings together global manufacturers, engineers, and suppliers to showcase innovations in CAD/CAM, 3D printing, tooling, and advanced production systems, driving growth in Japan’s manufacturing industry.
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